Semikondokito

Ohun elo ni Semikondokito Industry

GREEN jẹ Ile-iṣẹ Imọ-ẹrọ giga ti Orilẹ-ede ti a ṣe igbẹhin si R&D ati iṣelọpọ ti apejọ ẹrọ itanna adaṣe ati iṣakojọpọ semikondokito & ohun elo idanwo. Ṣiṣẹ awọn oludari ile-iṣẹ bii BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, ati 20+ miiran awọn ile-iṣẹ Fortune Global 500 miiran. Alabaṣepọ igbẹkẹle rẹ fun awọn solusan iṣelọpọ ilọsiwaju.

Awọn ẹrọ ifunmọ jẹ ki awọn asopọ micro-interconnects pẹlu awọn iwọn ila opin okun waya, ni idaniloju iduroṣinṣin ifihan agbara; formic acid vacuum soldering fọọmu awọn isẹpo ti o gbẹkẹle labẹ akoonu atẹgun <10ppm, idilọwọ ikuna ifoyina ni apoti iwuwo giga; AOI intercepts micron-ipele abawọn. Imuṣiṣẹpọ yii ṣe idaniloju> 99.95% ikore iṣakojọpọ ilọsiwaju, pade awọn ibeere idanwo to gaju ti awọn eerun 5G/AI.

Fi ibeere ranṣẹ

Awọn ohun elo ti Awọn onigbọwọ Waya ni Ile-iṣẹ Semikondokito

Ultrasonic Waya Bonder

Ti o ni agbara lati so pọ 100 μm-500 μm aluminiomu waya, 200 μm-500 μm Ejò okun waya, aluminiomu ribbons soke si 2000 μm jakejado ati 300 μm nipọn, bi daradara bi Ejò ribbons.

https://www.machine-green.com/wire-bonder/

Ibiti irin-ajo: 300 mm × 300 mm, 300 mm × 800 mm (aṣeṣe), pẹlu atunṣe <± 3 μm

Ibiti irin-ajo: 100 mm × 100 mm, pẹlu atunṣe <± 3 μm

Kini Imọ-ẹrọ Isopọ Wire?

Isopọ waya jẹ ilana isọpọ microelectronic ti a lo lati so awọn ẹrọ semikondokito pọ si apoti wọn tabi awọn sobusitireti. Gẹgẹbi ọkan ninu awọn imọ-ẹrọ to ṣe pataki julọ ni ile-iṣẹ semikondokito, o jẹ ki interfacing chirún pẹlu awọn iyika ita ni awọn ẹrọ itanna.

Imora Waya elo

1. Aluminiomu (Al)

Superior itanna elekitiriki vs. goolu, iye owo-doko

2. Ejò (Cu)

25% itanna ti o ga julọ / iba ina elekitiriki ju Au

3. Wura (Au)

Iwa adaṣe ti o dara julọ, resistance ipata, ati igbẹkẹle ifaramọ

4. Fadaka (Ag)

Itọkasi ti o ga julọ laarin awọn irin

Aluminiomu Waya

Aluminiomu Ribbon

Ejò Waya

Ejò Ribbon

Fi ibeere ranṣẹ

Awọn ohun elo ti AOI ni Semicon Die / Wire imora

Semikondokito Die imora & Waya imora AOI

Nlo kamẹra ile-iṣẹ 25-megapiksẹli lati ṣe awari idii somọ ati awọn abawọn isọpọ waya lori awọn ọja bii ICs, IGBTs, MOSFETs, ati awọn fireemu adari, iyọrisi oṣuwọn wiwa abawọn ti o tobi ju 99.9%.

https://www.machine-green.com/automatic-offline-optical-inspection-detector-aoi-d-500-machine-inspection-product/

Awọn ọran Ayẹwo

Ti o lagbara lati ṣe ayẹwo giga chirún ati fifẹ, aiṣedeede chirún, tẹ, ati chipping; solder rogodo ti kii-adhesion ati solder isẹpo detachment; awọn abawọn isọpọ waya pẹlu iwọn gigun tabi aipe giga, lupu lupu, awọn okun waya ti o fọ, awọn okun onirin ti o padanu, olubasọrọ waya, atunse okun waya, gbigbe lupu, ati gigun iru pupọ; alemora ti ko to; ati irin splatter.

Solder Ball / aloku

Chip Scratch

Ibi Chip, Dimension, Pulọọgi Meas

Chip Kontaminesonu / Ajeji elo

Chip Chipping

Seramiki Trench dojuijako

Seramiki Trench Kontaminesonu

AMB Afẹfẹ

Fi ibeere ranṣẹ

Awọn ohun elo tiformic acid reflow adiro ni Semikondokito Industry

In-Line Formic Acid Atunse Adiro

Eto naa ti pin si: eto gbigbe, alapapo/agbegbe tita, ẹyọ igbale, agbegbe itutu agbaiye, ati eto imularada rosin

https://www.machine-green.com/contact-us/

1. Iwọn otutu ti o pọju ≥ 450 ° C, ipele igbale ti o kere julọ <5 Pa

2. Ṣe atilẹyin formic acid ati awọn agbegbe ilana nitrogen

3. Oṣuwọn asan-nikan ≦ 1%, oṣuwọn ofo lapapọ ≦ 2%

4. Omi itutu agbaiye + nitrogen itutu agbaiye, ti o ni ipese pẹlu eto itutu omi ati itutu olubasọrọ

IGBT Power Semikondokito

Awọn oṣuwọn ofofo ti o pọ ju ni tita IGBT le fa awọn ikuna ifapa pq pẹlu igbona runaway, fifọ ẹrọ, ati ibajẹ iṣẹ ṣiṣe itanna. Idinku awọn oṣuwọn ofo si ≤1% ni pataki mu igbẹkẹle ẹrọ pọ si ati ṣiṣe agbara.